The CUSP Magnetron Sputter sources are the only commercially available sputter sources that are deep UHV (1x10-11Torr) compatible sources. The construction contains no elastometer seals and can be baked to 250°C. The feature of UHV compatibility enables ultra pure sputter deposition that eliminates unintentional oxidation and nitridation of materials.
The CUSP Sputter source series are perfectly suited for metal deposition such as e.g. reflective coatings, phase change materials, conductive metals, resistive films, insulating films or transparent electrical conductors (e.g. ITO).
The CUSP is the ideal choice when it comes to deposition of semiconductor materials such as e.g. Silicon or Germanium or compound semiconductors such as ZnO.
Optional extra high strength magnet sets allows the usage of CUSP sputter sources for magnetic materials deposition, e.g. in spintronics, micro-magnetics and intermetallics.
The CUSP can be used to deposit di-electrical materials such as e.g. ceramics or the oxides/nitrides of various metals (e.g. Al2O3) in reactive oxygen/nitrogen environment, as well as in oxygen/nitrogen gas mixes.
Lens Coatings/Optical Storage Coatings
CUSP Sputter sources are also used to deposit optical coatings e.g. for lenses to create reflective / anti-reflective / hard layers, phase change materials or simply colors.
The unique nanoparticle source (NanoGen Series) uses a modified CUSP sputter source to create Nanoparticles.
Wear Resistant Films
CUSP sources are used to deposit e.g. TiN films.
Photovoltaic Thin Films
CUSP sources are also suited for the deposition of thin films in photovoltaics such as solar cells.