Nanoparticle Deposition RF Atom Sources for atomic oxygen and atomic nitrogen Mini E-beam evaporators RF Ion Sources Thermal atomic oxygen and atomic hydrogen source Deposition systems

 

 

The CUSP series magnetron sputter sources are designed for high-rate, large area coatings. All sources are equipped as standard with integral gas-feed allowing a higher local pressure to exist immediately above the sputter target than in the surrounding chamber with the consequence that the source can be operated at lower overall chamber pressure.

 

All sources use a grounded cooling circuit, avoiding the need for lengthy plastic tubing to insulate the cooling water and allowing simple mains water to be used.

 

The sources are manufactured entirely from UHV-compatible materials. Flange-mounted sources can be removed without first needing to remove gas-injectors or shutters (if installed).

 

We offer three sizes of planar, circular magnetrons, 1", 2" and 3". Each size can be CF or ISO mounted or alternatively internally mounted with a variety of mounting options.

 

Options:

  • RF or DC operation

  • Internal, UHV or ISO mount

  • High-strength magnets

  • Balanced/unbalanced options

  • Integral shutters

 

 

Data taken with CUSP 2i (internally mounted) source at 200mm from source

Cusp 1U (1" CF mounted) source in operation

Model

CUSP 1

CUSP 2

CUSP 3

Mounting flange (CF 'U' version)

4 1/2"

6"

8"