Semiconductor Films

Dielectrics

Nanostructured Films

Sample Metallisation

Organic Material Deposition

SEM Sample Coatings

Lab Scale Teaching System

Sample Loading
In the basic system, sample entry can be made through a quick-load flange (o-ring sealed). For true UHV applications it is necessary to use a sample entry load-lock. Our load-lock uses a magnetically coupled linear/rotary transfer arm to transport samples to the main chamber.
Optionally, an integrated glove box can be included to allow preparation of the samples before loading into the chamber.

Sample Table
The sample table/manipulator is configured as standard for 2" (52mm) samples but can be modified for samples up to 4" in diameter or multiple smaller samples.

Options:

• Variable speed (2-20rpm) sample rotation
• DC or RF sample table bias
• Sample heating up to 800°C
• Sample cooling
• Z-shift (0-100mm)

The sample cradle in heated sample holders is manufactured of refractory materials to maintain system purity.

Sputtering Sources
The base ports can accommodate several sputtering sources. We can supply 1-3" magnetron sputtering sources for DC or RF operation. The sources can be equipped with standard or high-strength magnets and additionally balanced or unbalanced magnet sets. More details about our sources are available here.
Alternatively we are happy to incorporate existing or third party guns into the system.

E-beam Sources
E-beam evaporators are installed for thin film deposition of refractory metals or high-temperature ceramics. These instruments feature integral flux monitoring for all pockets, independent high-voltage lines, efficient structural cooling and co-deposition of up to four materials. Further details can be found here.

Nanoparticle Sources
Our NanoGen50 nanoparticle source can be installed on the chamber to allow controlled nanoparticle deposition onto the sample. Nanoparticles can be generated from any metal as well as from many compound materials (oxides, nitrides, carbides...) and alloys. The size of the particles is highly controlled - mean between ~0.5nm and 20nm with a narrow size distribution of ±15%. More details are available here.

Atomic Sources
For the growth of oxides or nitrides at low pressure, it is often necessary to use a more reactive form of oxygen (and certainly nitrogen) to form oxide or nitride compounds. Mantis Deposition manufactures RF plasma sources which are used to generate beams of higly reactive atomic oxygen or nitrogen. These can be incorporated to act alongside conventional metal deposition sources to grow high-quality compound layers. More info can be found here.

Thermal Sources
Thermal sources such as K-cells can be added. K-cells will fit through standard ports and optional, water-cooled cross-contamination shields can be added around them to improve overall system purity. More details are available here.

Thermal Gas Crackers
A thermal gas cracker can be installed in the chamber to crack various process gases. Our MGC75 gas cracker is 100% UHV compatible. It has e-beam heated iridium capillary which makes it very efficient in cracking various gases (60% oxygen and up to 90% hydrogen). In this configuration there is no electron impact ionisation and the emerging atomic beam is truly neutral. More info is available here.

Gauges
The system is configured as standard with full-range gauges to allow seamless pumpdown monitoring.
Ports can be included for RHEED, ellipsometry, residual gas analysers or thin film monitors.
Optionally, additional analysis equipment can be included at the user's request.

Automation
The system can be automated using touchscreen-based pumpdown or using process automation feature in in-house developed software.